| Manufacturer | BEEYUIHF |
|---|---|
| Place of Business | shenzhenshianadadianzishangwuyouxianzerengongsi,511, Building B,Getailong Industrial Park,Bantian Street,Longgang District,Shenzhen. Tel +86 15919856498 |
| Parcel Dimensions | 14.1 x 7.4 x 2.5 cm; 30 g |
| Item model number | CA-138-30g |
| Power Source | hand_powered |
| Included Components | solder paste |
| Batteries Required? | No |
| Item Weight | 30 g |
| Country of origin | China |
Lead-Free Solder Paste Sn42 Bi58 Low Temp Tin Paste for Electronics LED PCB BGA IC (1.05oz/30g)
Purchase options and add-ons
- Solder paste composition: Sn:42%, Bi:58%.
- Low temperature solder paste, melting point: 138°C (280F) , low temp solder paste suit for electronic components that cannot withstand temperatures of 200°C and above and require a SMD reflow process, especially for LED.
- Lead free solder flux gross weight: 1.05oz/30g syringe; Particle size: #3 (25-45 microns)
- Syringe solder flux paste property: lead free/smooth & uniform solder joints/reflow does not create tin beads and tin bridges.
- Lead free solder flux tin paste Application: welding radiator modules & LED welding & high frequency welding & LED PCB BGA CPU SMT rework tools.
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Product Description
Lead Free Solder Paste Sn42/Bi58, No Clean SMD Solder Paste 138C Melting Point
The melting point of low temperature tin is 138 degrees Celsius. Low temperature tin is mainly used for elements that cannot withstand high temperature device. For example, electronic components that cannot withstand high temperatures, such as LED chips.
Solder paste composition: Sn:42%, Bi:58%. Particle size: #3 (25-45 microns)
#8300 lead-free solder paste, the paste is fine and smooth, preheat the PCB before soldering, during the soldering process, the paste will automatically return the components to the position, and quickly fixed.
BEEYUIHF 138℃ Low Temp Sn42 Bi58 SMD LED PCB BGA Electrical Sodering Paste #8300
- Lead-free solder paste flux Wettability: Bright and even solder joints.
- PCB solder paste printability: Eliminates missing pits and lumps during printing.
- SMD lead-free solder paste Lifetime: Can print continuously for more than ten hours at room temperature without producing tin beads.
Properties and applications of lead-free 138℃ low melt electrical solder paste:
Solder paste syringe Perfect for sensors, wires, motors, fuses, connectors, metal housings, electronic components for lighting, SMT repair, implantation of BGA chip balls, etc.
BEEYUIHF lead-free solder paste Sn42 Bi58 syringe solder paste
BEEYUIHF solder paste for electronics need to set the temperature of the hot air gun: lead-free solder paste has a low melting point, melting point of 138 degrees, when soldering the hot air gun can be adjusted to 250320℃ֽ482℉~608℉) after preheating the PCB first.
BEEYUIHF lead-free solder paste Sn42 Bi58 syringe solder paste
High wettability
Automatic homing, solid and simple soldering of IC chips, solder paste specialized for IC and small components soldering.
finesse solder paste
Low temperature solder paste, low soldering temperature, soldering process will not affect other components.
Lower temperatures
Containing flux, it can be automatically homed during soldering, making it easy to solder even micro-small components into place.
Firmly soldering
With just a little solder paste, you can use a hot air gun to solder plugs and terminals securely, making it easy to operate and solder securely.
BEEYUIHF Product
9570 Rosin Solder Flux
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| 7150 Rosin Solder Flux | Flux with solder wick
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| Lead-Free Solder Paste
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| Solder Wick
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| Solder Wire
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Customer Reviews
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4.6 out of 5 stars 14
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4.8 out of 5 stars 12
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4.7 out of 5 stars 24
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4.3 out of 5 stars 36
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4.2 out of 5 stars 40
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4.4 out of 5 stars 23
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4.8 out of 5 stars 19
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Model
| #9570-65G | #8150-50G | #7150-50G | #2530-kit | #BF35 | #2530-3m | #SP86 |
|
Product name
| Rosin Solder Flux | Solder Flux | Rosin Solder Flux | Flux with solder wick | Lead-Free Solder Paste | Solder Wick | Solder Wire |
|
Material
| Rosin | Rosin | Rosin | Rosin | Sn42 Bi58 | Copper | Sn63 Pb37 |
|
Gross weight
| 65g | 50g | 65g | solder flux: 10g | 1.05oz/30g | 10g | 50g |
|
Soldering temperature
| 250320℃ֽ482℉~608℉) | 250320℃ֽ482℉~608℉) | 250320℃ֽ482℉~608℉) | 250320℃ֽ482℉~608℉) | 250320℃ֽ482℉~608℉) | 250320℃ֽ482℉~608℉) | 250320℃ֽ482℉~608℉) |
Product information
Technical Details
Additional Information
| ASIN | B0FNR4N7D3 |
|---|---|
| Customer Reviews |
4.2 out of 5 stars |
| 鶹 Rank |
|
| Date First Available | Aug. 26 2025 |













