AEIMIAIDE PTM7950 40x80x0.25mm Phase Change GPU Thermal Pad, AEIMIAIDE High Conductive Silicone Grease 8.5W/mK CPU Thermal Paste for Game Machine CPU GPU SSD Laptop
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Package include - 1x Thermal Pad 40x80x0.25mm, 1x Phillips Screwdriver, 1x Cleaning Wipe, 1x Spatula, Finger gloves, 1x Cleaning Brush.
Superior Heat Dissipation - PTM7950 is a proprietary material that provides superior reliability (pass 150˚C baking 1000 hours, T/C-B 1000 cycles) and maintains low thermal impedance (<0.04˚Ccm2/W @ no shim), making the PTM7950 series desirable for high performance integrated circuit devices.
Product Specifications - The PTM7950 measures 80x40x0.2mm with a thermal conductivity of 8.5W/m.K, designed to phase change and enhance heatsink performance.
Low Resistance - The PTM7950 is based on a new polymer PCM system that provides excellent interfacial wettability over the typical operating temperature range, resulting in meager surface contact resistance. Better suited for high-performance laptops and computers.
Wide Application - The size of 40x80mm PTM7950 heatsink thermal pad not only for PS5 Steam Deck CPU GPU SSD to heat dissipate, it also suits for computer、Laptop or other electrical products which CPU /GPU/ SSD need the PTM7950 thermal pad phase change heatsink.
AEIMIAIDE PTM7950 40x80x0.25mm Phase Change GPU Thermal Pad, AEIMIAIDE High Conductive Silicone Grease 8.5W/mK CPU Thermal Paste for Game Machine CPU GPU SSD Laptop
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PTM7950 is a thermally conductive filler material that softens at 45-55°C. Thermally conductive phase change materials have the special characteristic of softening and micro-flowing after absorbing heat, and then recovering to solid shape after cooling.
Long Using Life:
The PTM7950 heatsink thermal pad of thermal conductivity is as high as 8.5W/M.k. Compared with conventional silicone grease, the phase change pad has a longer durability(Other thermal silicone grease is prone to silicone overflow and prone to dryness and phase separation after using).The PTM7950 thermal pad phase change heatsink can flow repeatedly until the interface thickness is minimized, making the thermal conductivity better to extend using time.
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